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Will discuss ‘The Evolution of Material & Process Strategies for Handling Wafer Level Packaging Substrates.’
April 18, 2017
By: DAVID SAVASTANO
Editor, Ink World Magazine
The Advanced Packaging & System Integration Technology Symposium will be held in Wuxi, China. Organized by Yole Développement and the National Center for Advanced Packaging (NCAP China), this event will focus on the field of advanced packaging and include the newest developments in fan-out packaging, system in package, advanced substrates, 3D technology and embedded technologies, as well as MEMS & sensors packaging, radio frequency, and photonics. Dr. Tony D. Flaim, CTO for Brewer Sc...
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